Views: 36 Author: Site Editor Publish Time: 2021-09-15 Origin: Site
In recent years, the development of various power electronic technologies has been very rapid, and the requirements of many industrial power electronic equipment for high-performance, high-reliability, and high-power components are naturally also constantly improving.
In such an environment, the degree of heat dissipation per unit volume of these high-power power electronic components is getting higher and higher, which leads to a sharp increase in heat generation and temperature. The mechanical, chemical, and electrical problems caused by thermal drive are becoming more and more serious, which severely restricts product quality, stability, safety, and manufacturability. Take the IGBT module as an example, the heat dissipation problem of such high-power devices is getting more and more attention.
Many IGBT modules use air-cooled heat dissipation. IGBT air-cooled radiators are characterized by high heat dissipation efficiency, low cost, high reliability, simple structure, and convenient maintenance. The traditional air-cooled type has always been restricted by the process, mold, and The level of processing capability has not made great progress in the heat dissipation capability, and its application is only suitable for situations where the heat dissipation power is small and the heat dissipation space is large. Even so, the use of air-cooled radiators in power electronic devices is quite extensive and common.
When the high-power radiator is air-cooled, the working environment and the temperature changes on the original electronic components are different everywhere. The relative temperature on the inlet side is relatively low and the wind speed is higher, and the temperature on the outlet side is higher and the wind speed is lower. The temperature of the two original electronic devices on the same substrate is higher on the air outlet side.
According to the relevant technical research and development personnel, in the thermal design of electronic components, the choice of heat dissipation methods, as well as the testing, simulation, analysis, and optimization of them, will result in a structure with high thermal efficiency and low cost. It is particularly important to keep the internal junction temperature within the allowable range. aluminum heat sink supplier-Shengyida has long been committed to the research and development and design of custom heat sinks including IGBTs and other large-function devices, and customized high-power aluminum extrusion heat sinks for many users. If you need further information, please contact us.